| Document Date: 2010-09-08 14:40:09
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City SEPOPE / Lausanne / Osaka / / Company ABB Semiconductors AG / A. Individual / / Country Sweden / South Africa / / / Event Product Issues / / Facility stable SCFM / HVDC station / / / IndustryTerm rigid pressure contact technology / 2kA product / power system applications / press pack technology / power systems applications / profile applications / extra devices / semiconductor devices / optimized pressure pack solution / packaging technology / diode chips / pressure-contact technology / wireless press-pack modules / thyristor devices / voltage-source technology / power converter systems / individual semiconductor devices / silicon chips / power converter applications / thyristor-based line-commutated converter technology / power systems / Pressure management / power quality management / / Person Thomas Lang / Stefan Linder / Soto Gekenidis / Bo Bijlenga / Eric Carroll / Bo Danielsson / Andy Nilarp / Stefan Kaufmann / / / Position CEO / Collector-Emitter Voltage Nominal Collector / late CEO / / Product sub-module / / ProgrammingLanguage DC / / Technology semiconductor / SOA / IGBT-based voltage-source technology / rigid pressure contact technology / press pack technology / semiconductor devices / silicon chips / Key packaging requirements A. Pressure Management Introduction IGBT technology / diode chips / thyristor-based line-commutated converter technology / IGBT chips / plate Stiff housing Chips / pressure-contact technology / /
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ABB Semiconductors AG Innovative Press Pack Modules for High Power IGBTs