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![]() | Document Date: 2013-05-29 12:43:48Open Document File Size: 676,59 KBShare Result on FacebookCompanySonic / IXYS Corporation / Underwriters Laboratory / Diodes / MTI / UPS / DIL IXYS‘ Corp. / IXYS Semiconductor GmbH / IXYS Germany / Case / IXYS UK / Clare Inc. / Brushless DC Motors / /CountryGermany / / /EventReorganization / Natural Disaster / Product Release / /Facilitysquare Reverse Bias Safe Operating Areas / / /IndustryTermsystem solution / power semiconductor solutions / measurement equipment / designers with flexibility in device / transportation / silicon die technology leads / power control applications / multi-level solutions / embedded communications applications / power electronic applications / diode equipment / die technology / protection solutions / power conversion applications / transportation costs / rectifier integration technology / chopper systems / power transmission systems / power electronics / fitness equipment / ignition applications / low energy losses / hard-switching applications / product / gate drive energy / value chain / manufacturing processes / optimized semiconductor product / energy / chemical power supplies / input rectification applications / inverter applications / energy consumption / Typical applications / power management / telecommunications / thyristor technologies / power metallization chip / medical and industrial applications / turn-off energy loss vs. on-state voltage / energy losses / energy efficiency / packaged devices / load management / lower systems / power systems / voltage impulse technology / consumer electronics / high transportation cost / snubberless hard-switching applications / thin wafers technology / ceramic technology / snubberless hardswitching applications / renewable energy / leadframe devices / plant facility communications / oil proof / safer devices / footprint solutions / power applications / well-proven technologies / power equipment / package solution / Tests wireless applicaof / line applications / energy cost / metal disc / lowest cost solution / control systems / semiconductor packaging technology / surface mountable device / /Organizationded / solenoIXYS Integrated Circuits Division / /PersonFrank Wakeman / Jeroen van Zeeland / Bradley Green / Nathan Zommer / / /PositionPresident / VP of International Sales / head of marketing / CEO / designer / driver / collector / Automotive-Grade Gate Driver / common collector / Technical Support Manager / President of European Sales and Business Development / head of marketing in Germany / /ProductHarman On Time Radio / Robust Isolated Solid State Relay / K-1 IH / /ProgrammingLanguageDC / /TechnologyZGATE™ technology / rectifier integration technology / Clip-soldered die technology / heat transfer / SRAM / Integrated Circuits / thyristor technologies / semiconductor packaging technology / thin wafers technology / semiconductors / high voltage impulse technology / 83mm Si technology / Flash / power metallization chip / semiconductor / UDP / TCP/IP / Ethernet / firewall / /URLwww.ixysuk.com / www.ixys.com / www.zilog.com / www.ixysic.com / http /SocialTag |