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Microtechnology / Silicon / Microelectromechanical systems / Wafer / Flip chip / Hydrophobe / Thermal oxidation / Three-dimensional integrated circuit / Properties of water / Chemistry / Semiconductor device fabrication / Materials science


Microsoft Word - MEMS05_Fang.doc
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Document Date: 2004-10-27 21:09:24

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File Size: 459,32 KB

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