Back to Results
First PageMeta Content
Integrated circuits / Semiconductor device fabrication / Three-dimensional integrated circuit


Hint: fast, accurate and unrestricted exploration GSA 3DIC Packaging July 2014 E-System Design
Add to Reading List

Document Date: 2014-07-24 00:32:10


Open Document

File Size: 2,39 MB

Share Result on Facebook

Facility

University Tool PEEC / /

Organization

Georgia Tech’s Packaging Research Center / General Services Administration / /

Person

Identify Structures / /

Position

WB / /

Product

M-16 / /

ProgrammingLanguage

DC / /

Technology

technology Technology / Broadband / GUI / /

SocialTag