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Semiconductors / Integrated circuits / Semiconductor devices / Logic families / Power electronics / MOSFET / IEEE Electron Devices Society / Hot carrier injection / International Electron Devices Meeting / Electronic engineering / Electronics / Electromagnetism


July 2014 Vol. 21, No. 3 ISSN: Table of
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Document Date: 2014-07-15 10:49:27


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City

Piscataway / CERN / Waikoloa / Venice Lido / South Lake Tahoe / Micron / New York / San Diego / /

Company

Argonne National Laboratory / Electronics Engineers Inc. / Volkswagen / Agilent / Texas Instruments / Philips / Radio Frequency Flexible Electronics / Marvell Semiconductor / 2D Electronics / AT&T Bell Labs / Automotive Electronics / Bipolar Technologies / CISCO / Sanyo / General Electric / TriQuint / Terahertz Electronics / EDS / IBM / IEEE Electron Device Letters / Panasonic / Ge / Broadcom / M.-F. Li S. P. / Intel / Western Europe Jan Vobecky Abb Switzerland Ltd. / Treasurer Ravi M. Todi Qualcomm Technologies Inc. / Fairchild Semiconductor / Technical Committees & Meetings / /

Continent

Europe / North America / /

Country

Italy / Switzerland / Netherlands / Japan / Germany / Belgium / Jordan / United States / /

Currency

USD / /

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Facility

Jindal University of Louisiana / Stanford University / University of Illinois / University of Tokyo / University of Michigan / tunnel FET / National University of Singapore / Peyman Servati University of British Columbia E-mail / Brown University / Soviet Union Tomislav Suligoj University of Zagreb E-mail / Central Europe Zygmunt Ciota Technical University of Lodz E-mail / College of Engineering / Yu University of California / Northeast Asia Kuniyuki Kakushima Tokyo Institute of Technology E-mail / University of Wisconsin-Madison / Stanford Sierra Conference Center / Oregon State University / IMEC-Holst Centre / National Tsing Hua University / Institute of Electrical / Max Planck Institute / Wang University of California / Africa Jonathan Terry The University of Edinburgh E-mail / Clemson University / National Chiao Tung University / Royal Institute of Technology E-mail / /

IndustryTerm

scaled device / technology exhibition / hot-carrier / energy / memory technologies / metal-oxide-semiconductor field-effect transistors / information processing systems / crystal dislocation imaging / metal-gate technologies / metal-gate/ high-l technology / semiconductor applications / silicon technology / metal-gate / potential solution / photovoltaic systems / power applications / process technology / carrier confinement / steep turn-on device / electronics / wireless design / graduate students conducting electron devices / power devices / fiber optics applications / power semiconductor devices / carrier injection / semiconductor device technology / metal-gate/high-l / source energy barrier / metal-gate/ / luminescent imaging / open online publication venue / manufacturing / web address / electron channeling contrast imaging / system energy performance testing / typical chip / capacitive devices / /

NaturalFeature

Sierra Nevada Mountains / Coronado Island / Fallen Leaf Lake / Lake Tahoe / /

Organization

University of Michigan / Case Western Univ. / Rice University / National Tsing Hua University / Northwestern Univ. / Texas Tech University / IEDM Executive Committee / Education Committee / UCSD / PVSC Technical Program Chair University / IMEC-Holst Centre / Contributions Welcome EDS Board of Governors / National Chiao Tung University / Institute of Electrical / ESSDERC/ESSCIRC General Chair University of Padova Padova / IEEE CSICS Organizing Committee / National University of Singapore / Brown University / IEEE Electron Devices Society / Jean-Baptiste Begueret Technical Program Chair University of Bordeaux Flexible Electronics / University of California at San Diego / EDS Board of Governors Mid-Year / University of Illinois / University of Twente / University of Louisiana / University of Modena / University of Wisconsin / IEEE BCTM’14 Executive Committee / Fellow / and Asia Pacific Academy of Materials Academician / Max Planck Institute for Solid State Research / EDS Hosts First Chapter / Power Devices and ICs Committee / East Asia Mansun J. Chan Hong Kong Univ. of Sc. / Oregon State University / University of Tokyo / Peyman Servati University / Scripps Institution of Oceanography / College of Engineering / IIRW Committee / Northeast Asia Kuniyuki Kakushima Tokyo Institute of Technology E-mail / IEEE Power Electronics Society / Electron Devices Society / Publication Committee / University of California / Riverside / Optical Society of America Fellow / North Carolina State University / Institute of Electrical and Electronics Engineers / Central Europe Zygmunt Ciota Technical University of Lodz E-mail / IEEE EDS Technical Committee / Soviet Union Tomislav Suligoj University of Zagreb E-mail / STAFF / IEEE Reliability Society / Army Research Lab / Technical Program Chair University of Bordeaux / Congress / University of Edinburgh E-mail / Royal Institute of Technology E-mail / Stanford University / IEEE CSICS / EDS Board / Nanyang Technological University / Clemson University / Steering Committee / University of British Columbia / /

Person

Hervé Blanck / Craig Appel / Milton Feng / Walter Snoeys / Donald Kimball / Takao Someya / Thomas J. Watson / Bill McMahon / Ichiro Fujimori / Peide Ye (Purdue) / Luca Larcher / Xing Zhou / Physical Sciences / R. Huang L. Lunardi / Adam M. Conway / Augusto Gutierrez / Fernando Guarin / Don Disney / Bruce Doris / Gabriel Rebeiz / A. Nathan M. Shur / Fabio Marchiò / Joel Harmann / Hooman Darabi / Rajendra Singh / Andreas Aal / Mikael Ostling / S. Chung S. Deleonibus / Jean-Baptiste Begueret / C. H. Cheng / Albert Chin / Joyce Lombardini / Brian Downey / Waleed Khalil / Daniel Mauricio Camacho / Rina Tanaka / Sean Nicolson / Dragan Maksimovic / Paul Saunier / Donald Y.C. Lie / Christian Schlunder (Infineon) / Emilia Reggio Emilia / Supratik Guha / Brian Moser / M. Conway Lawrence Livermore Nat / Theresa Smith / John Long / Mark Rodwell / Renuka Jindal / Jan Vobecky / Hagen Klauk / Bin Zhao / Chris Hinkle / Scott DeBoer / Sorin Voinigescu / Sean King / Robert Trew / David Root / Umberto Celano / Iltcho Angelov / Leda Lunardi / Todd Martz / Dmitry Veksler (Sematech) / Krishna Shenai / Zhenqiang (Jack) Ma / Jonathan Terry / Kuniyuki Kakushima / Marie Curie / M.K. Radhakrishnan / Catherine Shaw / Tibor Grasser / Leda Lunardi North / Christopher Jannuzzi / Jason Ryan / Douglas S. McPherson / Francisco J. Garcia / Simon Bolivar / /

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Position

Director Candidates / VP for Publications and Products / Editorin-Chief / Professor / Technical Program Chair / VP of Technical / Vice President of Technical / Editor / Vice President of Regions/ / fgarcia@ieee.org Membership Administrator / Editor-in-Chief / ISPSD General Chair / plenary speaker / IIRW General Chair / Subcommittee Chair / President / Vice President of Membership and Services Mikael Ostling KTH / Symposium Chair / Arrangements Co-Chair/Chair / General Chair / Vice President of Publications and Products Bin Zhao / IIRW Communications Chair / Conference Manager / VP / Manager / Phone / distinguished professor / vice executive officer / young researcher / VP for Membership and Services / appropriate Editor / Dean / YP Chair / Vice-President of Regions/ Chapters Xing Zhou / rtodi@ieee.org Secretary / qualified Editor / deputy director / Director / conway8@llnl.gov Executive Director / Chair / Chief / Vice President / Vice President of Membership and Services / Subcommittee Chair and Asian Arrangements Co-Chair/Chair / /

ProvinceOrState

Louisiana / California / Texas / New Jersey / Wisconsin / Illinois / Hawaii / New York / Michigan / /

PublishedMedium

the IEEE Journal / /

Region

Western Europe / Central USA / Scandinavia / Northeast Asia / East Asia / Latin America / South Asia / Eastern Europe / Southeastern USA / Middle East / Western USA / Central Europe / /

SportsLeague

Stanford University / /

Technology

memory technologies / aw@ee.ucr.edu President-Elect Samar Saha Ultrasolar Technology / optoelectronics / Recent Trends The IC chips / nanoscale CMOS technologies / semiconductor / Tomography / microwave / Laser / flash memory / GaN technology / Dielectric / simulation / metal-gate technologies / metal-gate/ high-l technology / process technology / integrated circuits / IC chip / MEMS / recombination / Semiconductor Devices / SiGe technology / typical chip / CMOS technology / silicon technology / system-on-chip / semiconductor device technology / Nanoscale SiGe BiCMOS technology / integrated circuit / /

URL

www.csics / www.iirw.org / http /

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