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Microtechnology / Through-silicon via / Wafer / EV Group / Three-dimensional integrated circuit / Semiconductor device fabrication / Electronics / Electronic engineering


Project result CT207 I D/TSV integration platform goes a long way in successfully meeting IC manufacturing challenges
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Document Date: 2014-09-16 09:43:41

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File Size: 664,34 KB

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City

Paris / /

Company

LETI Datacon EVGroup / Ericsson / /

Continent

Asia / Europe / /

Currency

USD / EUR / /

/

Facility

B Austrian Institute / /

IndustryTerm

wireless applications / communications technology industry / excellent tools / 3D products / silicon photonic systems / sensor-integration applications / alignment equipment / semiconductor manufacturing world / semiconductor manufacturing / heterogeneous technologies / manufacturing challenges / nano-/microelectronic solutions / manufacturing opportunity / heterogeneous systems / chip-on-chip / specialised process equipment / automotive applications / front-end technologies / dedicated tools / 3D system manufacturing / on delivering nano-/microelectronic solutions / /

Organization

CATRENE Office / Institute of Technology / ASM-B Austrian Institute / /

Person

Brigitte Descouts / /

/

Position

ST Tours STMicroelectronics TUW Project leader / /

Product

F-75014 Paris / /

ProgrammingLanguage

DC / /

Technology

semiconductor / CMOS technologies / security Energy efficiency Digital lifestyle Design technology / chip-on-chip / using front-end technologies / key enabling technology / /

URL

www.catrene.org / /

SocialTag