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Hot Chips 9 A Symposium of High-Performance Chips August 24-26, 1997 Kresge Auditorium Stanford University Palo Alto, California
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Document Date: 2013-07-27 22:48:00

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City

Palo Alto / /

Company

IBM / Silicon Graphics Inc. / Rambus / Digital Equipment Corporation / Motorola / Intel Corporation / Hitachi / Apple Computer / Sun Microsystems Inc. / TriTech Microelectronics International Inc. / Toshiba / Hewlett-Packard Company / Processors Ruby Lee / Texas Instruments / Cirrus Logic / Verdande Group Inc. / NEC Corporation / France Telecom / On-Chip L2 Cache / /

Facility

Kresge Auditorium Stanford University / University of Tokyo / Rob Pike / University of California / Pipeline Implementation / /

OperatingSystem

Inferno / /

Organization

MIT / University of Tokyo / University of California / Berkeley / Federal Communications Commission / Stanford University / /

Person

John Wawrzynek / Reed Hundt / James Meindl / Urs Heitzle / Robert Garner / Fumio Arakawa / Allen J. Baum / Alan Jay Smith / Dominique Barthel / Jeff Slaton / Brad Burgess / Kevin Normoyle / Jennifer Anderson / S. Diane Smith / Richard Malinowski / Paul Kalapathy / Takashi Nanya / Mitsuo Saito / Keith Diefendorff / /

Position

Session Chair / Chairman / Keynote Speaker / General Chair / Controller / /

Product

Real-time Graphics Processor Kok Chin Chang / Kok Chin Chang / /

ProgrammingLanguage

Java / /

ProvinceOrState

Laguna / California / /

SportsLeague

Stanford University / /

Technology

Alpha / HDTV / Lighting Processor / Media Processor / pdf / Dynamic Execution Processor / artificial intelligence / MMX™ Technology / Java / Real-time Graphics Processor / Smart On-Chip / 3Dlabs Reality Co-Processor / MIT Multi-ALU Processor / Multimedia Superscalar RISC Processor / /

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