image processing digital logic / 3D multilayer technologies / chips targeting enterprise applications / severe and new technology / e-compass / lower volume devices / device / turn-key software products / 3D device / multimode sensor devices / 3D imaging applications / technology devices / test equipment / sensor devices / low power applications / personal electronic devices / potential solution / non-electrical devices / a lot of additional software / similar tools / double-patterning lithography algorithms / metal gates / real-time adaption / automatic test equipment / semiconductor suppliers software / high volume manufacturing / a lot of innovative software products / manufacturing test / manufacturing / volume devices / mobile computing devices / computing / image sensor device / micro-electromechanical systems / Thin wafer/media handling / shippable product / time creating new customer software / Automotive industry applications / being developed using 3D multilayer technologies / /
Organization
ITRS Test Chapter / US Federal Reserve / Maintaining Unit / /
Position
driver / /
ProgrammingLanguage
visual basic / /
Technology
semiconductor / Radiation / MEMS / non-digital CMOS technologies / smart phones / probe cards / mobile computing / Digital cameras / cell phones / double-patterning lithography algorithms / SRAM / image processing / using 3D multilayer technologies / Mobile devices / /
INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS[removed]EDITION