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INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS[removed]EDITION
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Document Date: 2014-03-13 15:51:20

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City

San Jose / /

Company

CRC Press / NIST / The MEMS Technology Working Group / SEMICONDUCTORS 2013 EDITION MICRO-ELECTRO-MECHANICAL SYSTEMS / MEMS Industry Group / SUMMARY Micro-Electro-Mechanical Systems / Micro-Electro-Mechanical Systems / /

Currency

pence / /

Event

Business Partnership / /

IndustryTerm

3D packaging technologies / video game devices / supply chain / device manufacturing / technology gaps / surgical tools / wearable technologies / consumer medical applications / technology requirements / manufacturing cost / manufacturing efficiency / signal processing / possible solutions / automotive applications / mobile internet devices / manufacturing process / communications interfaces / semiconductor technologies / chip / technology roadmapping / device testing protocols / device technologies / portable medical diagnostic systems / consumer electronic devices / consumer applications / gas sensors / manufacturing / mobile internet device manufacturers / individual solutions / multimode sensor technologies / /

Organization

International Roadmapping Committee / MEMS Difficult Challenges Challenge Design and Simulation Fabrication Assembly / MEMS TWG / ITRS’s International Roadmapping Committee / /

Person

Gordon Moore / /

Position

driver / moving forward / /

ProvinceOrState

California / /

PublishedMedium

IEEE Spectrum / /

Technology

semiconductor / These device technologies / wearable technologies / smart phones / separate chip / 10 DOF multimode sensor technologies / integrated circuits / device technologies / IC chip / semiconductor technologies / testing protocols / smartphones / multimode sensor technologies / Simulation / 3D packaging technologies / MEMS technologies / device testing protocols / medical diagnostic / integrated circuit / /

URL

http /

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