| Document Date: 2014-03-13 17:17:43
Open Document File Size: 249,79 KBShare Result on Facebook
City Si / Boston / New York / / Company RF HF / Artech House Inc. / Group III-V Compound Semiconductor / CBC / DRAPER Laboratories / Analog/Mixed-Signal Technologies / HP / AMS Chapter / RF Complementary Metal Oxides Semiconductor / / IndustryTerm passive on-chip device device technologies / semiconductor technology / plateau technologies / technology roadmapping bodies / challenge facing power amplifier devices / silicon processing power / silicon technologies / individual metal heights results / compound semiconductor technologies / power density devices / mobile millimeter-wave communications / power devices / lower cost solutions / manufacturing control / passive on-chip devices / higher value devices / active device / given device / frequency applications / compound semiconductor devices / technology choices / electrical and electronic products / research devices / measurements infrastructure / base technology make / technology requirements / driver devices / Communications products / chipon-chip heterogeneous integration technologies / standby-power technologies / bipolar devices / thermal management / phone manufacturer / exemplary applications / communications standards / Mesh-networks / digital processing power / circuit applications / technology selection / technology comparison / power applications / metal / metal level / circuits technology / On-chip passive device technologies / materials technologies / portable applications / manufacturing control challenges / radar imaging / active and passive devices / Consumer products / materials systems / mode devices / active transistor devices / communications applications / device technologies / highvolume manufacturing / metal oxide semiconductor / technology-device sub-groups / potential devices / manufacturing / passive devices / inherent minority carrier mobility differences / basic devices / technology barriers / battery technology / on-chip / voltage devices / base station applications / / Organization Technical Committee / System Drivers Chapter / International Electrotechnical Commission / ITRS / / Person Hong Yan / / Position driver / collector / NIST Director / Director / November / thickness and increased collector / / Product iPAD / FOMs / FETs / / ProgrammingLanguage DC / / ProvinceOrState New York / Pennsylvania / / Technology semiconductor / circuits technology / On-chip passive device technologies / semiconductor technology / semiconductor devices / PASSIVE ON-CHIP / chipon-chip heterogeneous integration technologies / microwave / HV chip / packaging/integration technologies / lithography / materials technologies / SiGe technologies / silicon technologies / device technologies / mobile devices / III-V compound semiconductor technologies / MEMS / semiconductors / low standby-power technologies / passive on-chip device device technologies / system-on-chip / Si technology / dielectric / plateau technologies / battery technology / RADIO FREQUENCY / GSM / / URL http /
SocialTag |
INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS[removed]EDITION