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Electronic engineering / Three-dimensional integrated circuit / Chip scale package / Wafer dicing / Wafer / Microelectromechanical systems / Interposer / EV Group / Through-silicon via / Semiconductor device fabrication / Electronics / Microtechnology


Business Models to Support Supply Chain Readiness for Mainstream 2.5D & 3D Technologies Presented by
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Document Date: 2014-01-22 10:42:11

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File Size: 1,93 MB

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City

San Jose / /

Company

GPU / /

IndustryTerm

process technologies / 2L metal / interposer chips / Wireless FC BGA 3D IC / /

NaturalFeature

Mount TSV / Ball Mount / /

Organization

EPS Heterogeneous Integration Assembly / General Services Administration / /

Person

Rich Rice Sr. / /

Position

Vice President ASE Group Jan / IC designer / Sr. Vice President / /

Technology

interposer chips / FPGA / 5 Si Interposer Enabling Chip / MEMs / enabling process technologies / 3D Technologies / /

SocialTag