Xilinx SSI Technology Concept to Silicon Development Overview Shankar Lakka Aug 27th, 2012 - Interposer - Document - PDFSEARCH.IO

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	Xilinx SSI Technology Concept to Silicon Development Overview Shankar Lakka Aug 27th, 2012 Add to Reading List Document Date: 2013-07-28 00:30:14 Open Document File Size: 1,26 MB Share Result on Facebook Company Xilinx Inc. / LC Sooner 2M LC / w/ Stacked Silicon Interconnect 1M LC / TSMC / Amkor / ES 2M LC / / IndustryTerm technology boiler plate / low-k stress management / conventional metal layers / micro-bump technology / / Person Shankar Lakka / / Product M-16 / / Technology FPGA / Inc. 2.5D Performance vs. Monolithic Lid Serdes Chip / laser / 3D Technology / micro-bump technology / 65 nm Passive Interposer Micro-bump TSV Interposer Interposer /Package Technology Technology / Monolithic packaged 28Gbps Serdes Substrate Lid Serdes chip / / SocialTag Fabless semiconductor companies Reconfigurable computing Xilinx Field-programmable gate array Semiconductor device fabrication Through-silicon via Interposer Electronic engineering Integrated circuits Electronics

Xilinx SSI Technology Concept to Silicon Development Overview Shankar Lakka Aug 27th, 2012Add to Reading List