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Semiconductor device fabrication / Microtechnology / SDRAM / Field-programmable gate array / Xilinx / 3DS / Interposer / Through-silicon via / Three-dimensional integrated circuit / Electronic engineering / Integrated circuits / Electronics


Amkor’s Next Generation Packaging Solutions … the future is now! Paul Silvestri I Director, TSV Product Development
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Document Date: 2014-10-23 00:19:08

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File Size: 2,41 MB

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Company

Xilinx / High End Systems / Amkor / /

OperatingSystem

Pilot / /

Person

Paul Silvestri / /

Position

TSV General / Director / TSV Product Development Amkor Confidential / /

Product

Packaging Solutions / 3D TSV Platform / /

Technology

FPGA / lithography / dual ARM processor / /

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