3DIC in Production, Making Chip-Stacking a Reality in the FPGA Market Glenn O’Rourke Vice President of Manufacturing Technology - Interposer - Document - PDFSEARCH.IO

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	3DIC in Production, Making Chip-Stacking a Reality in the FPGA Market Glenn O’Rourke Vice President of Manufacturing Technology & Product Quality October 2013 Add to Reading List Document Date: 2014-01-22 10:41:36 Open Document File Size: 2,80 MB Share Result on Facebook Company Xilinx / Thermal Interface Metal / 3D Heterogeneous Solutions / TSMC / / IndustryTerm conventional metal layers / carrier carrier / / Person Gordon Moore Die Cost Monolithic / / Position FPGA Market Glenn O’Rourke Vice President of Manufacturing Technology & Product Quality October / / Technology FPGA / Generation Technology / / SocialTag Semiconductor device fabrication Fabless semiconductor companies Reconfigurable computing Xilinx Field-programmable gate array Through-silicon via Interposer Three-dimensional integrated circuit Integrated circuits Electronic engineering

3DIC in Production, Making Chip-Stacking a Reality in the FPGA Market Glenn O’Rourke Vice President of Manufacturing Technology & Product Quality October 2013Add to Reading List