CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007

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Date: 2016-07-20 11:09:32 Electronic engineering Electrical engineering Electromagnetism Semiconductor device fabrication Packaging Electronics manufacturing Ball grid array Surface-mount technology Solder Reflow soldering Integrated circuit packaging Reliability		CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007 Add to Reading List Source URL: www.sonoscan.com Download Document from Source Website File Size: 407,57 KB Share Document on Facebook

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