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Solid mechanics / Elasticity / Deformation / Buckling / Strength of materials / Fracture mechanics / Stress intensity factor / Fracture / Bending / Mechanics / Physics / Materials science


JOURNAL OF APPLIED PHYSICS 105, 073514 共2009兲 Competing failure mechanisms in thin films: Application to layer transfer L. Ponson,a兲 K. Diest, H. A. Atwater, G. Ravichandran, and K. Bhattacharya Division of Engine
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Document Date: 2009-04-07 16:21:33


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Boca Raton / Rome / Pasadena / London / New York / /

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Cambridge University Press / CRC Press / /

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United States / /

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American Institute of Physics Downloaded / California Institute of Technology / American Institute of Physics / /

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energy release rate / fracture energy / elastic energy / telephone-cord-like patterns / telephone-cord-like geometry / interfacial fracture energy / lowest energy plane / realistic systems / electronics / telephone-cord / 3D systems / heated gas / possible solutions / lower fracture energy / anisotropic media / telephone-cord-like cracks / ceramic-silver fracture energy / energy / /

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California Institute of Technology / Cambridge University / American Institute of Physics Downloaded / American Institute of Physics / Center for the Science and Engineering of Materials / U.S. Securities and Exchange Commission / K. Diest / H. A. Atwater / G. Ravichandran / and K. Bhattacharya Division of Engineering and Applied Science / /

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J. Archer / /

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JOURNAL OF APPLIED PHYSICS / /

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