Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street

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Date: 2016-07-20 11:09:32		Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Add to Reading List Source URL: www.sonoscan.com Download Document from Source Website File Size: 861,19 KB Share Document on Facebook