Tainan / Houston / Redondo Beach / Pt / Antimonide / Washington / DC / Sb / Torrance / /
Company
B.R. Bennett N.A. / Naval Research Laboratory / Northrop Grumman Space Technology / M.G. Ancona N.A. / TRW Inc. / Advanced Microelectronics Laboratory / J.B. Boos N.A. / Lg / Electro-Optek Corporation / Martin Marietta Laboratories / /
Country
Cyprus / Taiwan / United States / / /
Facility
The George Washington University / College Park / Advanced Microelectronics Laboratory / The University of Illinois at Chicago / Nanoelectronics Processing Facility / Pennsylvania State University / National Cheng Kung University / Virginia Polytechnic Institute / The Institute of Electronics / University of California / Cheng-Shan Institute of Science / Naval Research Laboratory / Michigan State University / Drexel Institute of Technology Philadelphia / University of Maryland / Massachusetts Institute of Technology / Johns Hopkins University / State University / /
IndustryTerm
energy levels / nominal carrier density / wet chemical etching / low-power logic transistor applications / low-power applications / technology development / power electronic devices / light hole energy separation dependence / imaging / metal / length devices / recess gate technology / gate metal definition / mixed-signal applications / microwave applications / electronic devices / material systems / ultra-low power applications / e-beam / space applications / acid-based solution / sheet carrier density / space-based communications / sheet carrier concentration / electronics technology / heterostructure devices / energy spacing / quantum devices / logic applications / selective chemical etch / large-scale active-array space-based radar applications / disruptive technologies / buried-gate technologies / energy-band diagram / micro-electro-mechanical systems / temperature semiconductor device applications / semiconductor device / electron device technology / portable systems / electron sheet carrier density / low-power complementary logic technology / refractory metallization systems / Wireless Compon / in increasing the energy spacing / /
MusicGroup
MMICs / InAs/AlSb / /
Organization
Technical Program Committee / Defense Advanced Research Projects Agency / The George Washington University / Washington / the Johns Hopkins University / University of Maryland / University of California / Santa Barbara / Steering Committee of the InP / University of Illinois at Chicago / Massachusetts Institute of Technology / University of California / Irvine / Polytechnic Institute / State University / American Physical Society / Steering Committee of the InP and Related Materials Conference / Institute of Electronics / Palestine Liberation Organization / Cheng-Shan Institute of Science and Technology / Michigan State University / National Cheng Kung University / Air Force’s Solid State Sciences Division / University of Maryland / College Park / the Pennsylvania State University / Electronic Materials Committee / Drexel Institute of Technology Philadelphia / Board of Advisory Editors / Electrical Engineering Department / /
Person
M. Wojtowicz / Brian R. Bennett / Michael D. Lange / Mario G. Ancona / M.D. Lange / Nicolas A. Papanicolaou / Y.C. Chou / Robert Bass / Ben V. Shanabrook / M. Barsky / R. Tsai / Mark Rosker / Ben V / James G. Champlain / A. Oki / T.P. Chin / A.L. Gutierrez / J. Brad Boos / /
Position
senior HEMT product engineer / Subproject Manager / head / Superintendent / Engineer / Principle Investigator / Electronics Engineer / research physicist / Assistant Research Engineer / Program Chair / scientist / Manager for the programs / member / /
IEICE TRANS. ELECTRON., VOL.E91–C, NO.7 JULY[removed]INVITED PAPER