NEXX Systems / Tokyo Electron / Process Technology Center Tokyo Electron Technology Development Institute Inc. / Tokyo Electron US Holdings Inc. / TEL NEXX Inc. / /
Continent
America / /
Country
Taiwan / Belgium / France / Japan / United States / South Korea / /
Event
M&A / Name Change / Company Expansion / /
Facility
Korea Taiwan TEL Technology Center / LLC Korea TEL Technology Center / International Academic-Industrial Collaboration Center / TEL Technology Center / Tohoku University / /
IndustryTerm
equipment technology / manufacturing equipment technology / technology center / semiconductor production equipment technology / semiconductor devices / photovoltaic panel production equipment technology / integration technology / thinner and smaller devices / design technology / production equipment technology / electronic devices / final wafer processing step / 3D interconnect technology arena / memory device / yield products / wafer-level packaging technology / multifunctional mobile devices / metal deposition technology / /
Organization
Process Technology Center Tokyo Electron Technology Development Institute / Tohoku University’s Graduate School / International Academic-Industrial Collaboration Center for Integrated Electronics Research and Development / Tohoku University / /
Person
Tetsuo Endoh / /
ProvinceOrState
Ibaraki Prefecture / /
Technology
semiconductor / integration technology / manufacturing equipment technology / semiconductors / photovoltaic panel production equipment technology / STT-MRAM production equipment technology / metal deposition technology / semiconductor devices / smartphones / TOHOKU UNIVERSITY Device design technology / mobile phones / IC chips / Random Access / Word line Bit line Production equipment technology / semiconductor production equipment technology / wafer-level packaging technology / packaging technology Chip Bump TSV*1 3D integration Chip Thinner Wire Flip chip / mobile devices / /