Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Jun Wang, Michael Merschky, Tafadzwa Magaya

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Date: 2017-03-20 07:48:05		Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Jun Wang, Michael Merschky, Tafadzwa Magaya Add to Reading List Source URL: www.atotech.com Download Document from Source Website File Size: 2,55 MB Share Document on Facebook