THURSDAY 241 EuMC43 Advanced Packaging

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Date: 2015-05-22 09:43:01 Telecommunications engineering Antti Räisänen Weather radar Passive radar MIMO Active Electronically Scanned Array Antenna RF MEMS Phased array Radar Technology Wireless		THURSDAY 241 EuMC43 Advanced Packaging Add to Reading List Source URL: www.eumweek.com Download Document from Source Website File Size: 249,11 KB Share Document on Facebook

	Didier Lacroix, Observer AnaCatum Design AB Mr. Lacroix serves as advisor and investor into disruptive semiconductor technology startups (i.e MEMS, NANO, Analog / RF IP). He has been MicroGen System’s strategic busines DocID: 1lEXe - View Document
	Hermetic Wafer-Level Packaging development for RF MEMS switch C. Ferrandon1*, F. Greco1, E. Lagoutte1, P. Descours1, G. Enyedy1, M. Pellat1, C. Gillot1, P. Rey1, D. Mercier1, M. Cueff1, X. Baillin1, F. Perruchot1, N. Sil DocID: 1g8Us - View Document
	Monolithic fabrication of millimeter-scale machines DocID: 1fUva - View Document
	Miniaturization – A paradigm shift in advanced manufacturing and education** Tai-Ran Hsu, Ph.D. ASME Fellow and Member of IEEE Microsystems Design and Packaging Laboratory Department of Mechanical and Aerospace Enginee DocID: 1fNtY - View Document
	Proceedings of IPAC2013, Shanghai, China WEPFI012 CONCEPTUAL DESIGN OF ILSF RF SYSTEM Kh. Sarhadi*, H. Ajam, H. Azizi, M. Fereidani, M. Jafarzadeh, S. Pirani, R. Safian, A. Shahverdi, DocID: 1fI1D - View Document