IBM / Noise Group 1 Noise Group 2 Noise Group / W/BYPASS Noise Group 1 Noise Group / /
Currency
COP / /
IndustryTerm
metal / programmed using product / level support processor / level test infrastructure / product level packaging technology / manufacturing / point tools / large chip / /
Person
Bradley D. McCredie / /
Position
General / /
Technology
design verification / 5500 4mil C4 chip / POWER4 chip / cycle programmable noise generation Chip / product level test requirements POWER4 Test Chip Hot Chips / 1.5V Package Technology / Design objectives Chip overview Technology Circuits Implementation Results POWER4 Test Chip Hot Chips / Understand product level packaging technology / lithography / Technology feasibility Understand product level Silicon technology / chip design / 1 ts_tte_stop trace_run POWER4 Test Chip / 99 Test Chip / SRAM / 3 0 POWER4 Test Chip / CMOS 8S Technology / large chip POWER4 Test Chip Hot Chips / 100 200 300 400 500 600 Hot Chips / 99 Technology / service processor interface On chip tester Chip / 8mil pitch POWER4 Test Chip Hot Chips / vhdl / 2 / 217 chip / GHz bandwidth POWER4 Test Chip Hot Chips / 100W Chip / 1 Hot Chips / GPS / /
POWER4 Test Chip Bradley D. McCredie Senior Technical Staff Member IBM Server Group, Austin August 14, 1999