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Integrated circuit / Infineon Technologies / Epcos / Ericsson / Semiconductor Equipment and Materials International / Technology / Semiconductor companies / Robert Bosch GmbH


T503-medea+ (lo1[removed]:32
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Document Date: 2009-03-25 10:37:21


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File Size: 85,38 KB

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Company

Fujitsu / PACKAGING Partners / EPCOS / NEC / Matsushita / Lucent / Ericsson / Delphi / Alcatel / Tyco / Infineon / Denso / STMicroelectronics / TRW / Strategies Unlimited / /

Continent

Europe / /

Country

United States / /

/

Facility

Robert Bosch Chalmers University / Chalmers University / /

/

IndustryTerm

mobile communication networks / appropriate tools / based wireless / automotive electronics system houses / nate car electronics / tre-wave products / wave applications / analytical tools / volume products / mobile telecommunications equipment ogy / local area networks / communications industry / sumer electronics / automotive applications / space-saving package technologies / value chain / able electronic car / ule-component supplier / mance devices / automotive electronics industries / telecommunications / higher frequency applications / flip-chip / automotive systems / consumer applications / car components / automotive products / electronics production / high-volume manufacturing techniques / cruise control applications / ductor manufacturer / near-distance radar vision systems / /

Organization

Information Society / Robert Bosch Chalmers University / Chalmers University of Technology / Chalmers University / MEDEA+ Office / /

Person

Thomas Lewin / Robert Bosch / /

/

Position

Project leader / leader / co-operative / /

PublishedMedium

the Information Society / /

Technology

semiconductor / microwave / mobile phones / integrated circuits / space-saving package technologies / GaAs technology / simulation / local area networks / 3G / integrated circuit / /

URL

http /

SocialTag