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Chemical engineering / Heat spreader / Heat sink / Diamond / Thermal conductivity / Heat pipe / Chemical vapor deposition of diamond / Copper / Dymalloy / Chemistry / Mechanical engineering / Heat transfer


Diamond Composite Heat Spreader James C. Sung*,1,2,3, Ming-Chi Kan1, Shao-Chung Hu1 Michael Sung4, Barnas G. Monteith5 Address: KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan, R.O.C. Tel:
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Document Date: 2009-11-04 15:58:14


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File Size: 1,40 MB

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City

San Francisco / Boston / /

Company

KINIK Company / Intel / Advanced Diamond Solution Inc. / /

Country

Taiwan / United States / /

Currency

USD / /

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Facility

National Taipei University of Technology / R.O.C. National Taiwan University / /

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IndustryTerm

metal / diamond/metal composites / large semiconductor chips / diamond/metal composite / /

Organization

National Taiwan University / Taipei / National Taipei University of Technology / Taipei / /

Person

James C. Sung / /

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Product

HeaThruTM / /

ProvinceOrState

Massachusetts / /

Technology

semiconductor / CPU chip / laser / heat transfer / semiconductors / simulation / large semiconductor chips / flash / CVD / /

URL

http /

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