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First Draft of Hybrid Memory Cube Interface Specification Released Industry Leaders on Track to Complete Final Specification by Year End BOISE, Idaho and San Jose, CA, August 14, 2012 – The Hybrid Memory Cube Consorti
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Document Date: 2013-05-10 12:23:37

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City

San Jose / /

Company

Xilinx Inc. / IBM / Micron Technology Inc. / SK hynix Co. / OpenSilicon Inc. / Open-Silicon Inc. SK / Samsung Electronics Co. Ltd. / HP / Microsoft Corporation / Altera Corporation / Samsung Electronics Co. Ltd. SK / /

IndustryTerm

present memory technology / measurement applications / electronics / interface protocol / technology providers / /

Organization

HMCC / /

Person

Rob Sturgill / Hugh Durdan / Portfolio / /

Position

architect / Vice President / /

Product

Microsoft Corporation Portable Audio Device / /

ProvinceOrState

California / Idaho / /

Technology

semiconductor / Hybrid Memory Cube technology / present memory technology / interface protocol / /

URL

www.hybridmemorycube.org / /

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