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Signal cables / Physical quantities / Cables / Telecommunications engineering / Radio electronics / Microstrip / Transmission line / Electrical impedance / Antenna / Electronic engineering / Electromagnetism / Electronics


IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 26, NO. 2, MAY[removed]Causal Characteristic Impedance of Planar Transmission Lines
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Document Date: 2003-09-30 12:36:36


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Hannover / Oxford / Hildesheim / Braunschweig / Storrs / Hastings / /

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Microwave Metrology Group / Boulder CO. / Clarendon Press / Furukawa / Lawrence Berkeley Laboratory / Electrical Engineering Laboratory / IEEE TRANSACTIONS / /

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National Institute of Standards and Technology / Washington University / University of Illinois / Courant Institute of Mathematical Sciences / University of Hannover / Hastings College / University of Chicago / New York University / Laboratory of Information Technology / University of California / Yale University / /

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wide metal-insulator-semiconductor transmission line / passive devices / spectral-domain algorithm / scientific computing / /

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the University of Chicago / Chicago / New York University / University of Illinois / Urbana-Champaign / Washington University / St. Louis / University of Hannover / Hannover / University of California / Berkeley / Department of Commerce Bronze and Silver Medals / Yale University / Hastings College / National Institute of Standards and Technology / Electromagnetic Fields Division / Department of Commerce / Laboratory of Information Technology / Laboratory for Information Technology / Universität Hannover / Courant Institute of Mathematical Sciences / /

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Nat / David K. Walker / Dylan F. Williams / Hartmut Grabinski / Bradley K. Alpert / Uwe Arz / /

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Manager of the Division of Design and Test / Editor / metal conductor / center conductor / Casualty Actuary / signal conductor / Founder / Research Associate / microstrip center conductor / wide center conductor / conductor / Teaching Assistant / the Manager of the Division of Design and Test / Visiting Researcher / /

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semiconductor / broadband / remote sensing / Information Technology / microwave / integrated circuits / spectral-domain algorithm / dielectric / simulation / Digital Object Identifier / microwave technology / /

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