| Document Date: 2014-04-22 13:20:26
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City New York / / Company Sony / Intersil Corporation / / Country United States / / / Facility Foundry CMOS / University of California / / IndustryTerm off-chip / plastics / inter-server/container communications / transceiver systems / intrachip communications / carrier signal / electromagnetic energy / transceiver technology / signal coupling device / switch device / digital communications / electronic devices / thunderbolt technology / energy/cost-efficient / energy efficiency / cable-to-chip / network-on-chip / fiber-optical communications / long haul communications / carrier-modulated communication / compact link systems / transmission media / nm active cable solutions / broadband communications / short distance communications / energy / WIRELESS COMPONENTS LETTERS / / Organization University of California / Los Angeles / Center for Domain Specific Computing / Department of Electrical Engineering / / Person Jason Cong / Chung Frank Chang / / Position output driver / / ProvinceOrState California / / Technology broadband / lasers / dielectric / silicon-based technologies / MICROWAVE / thunderbolt technology / Digital Object Identifier / DSP / integrated circuits / Optical fiber / mm-Wave CMOS transceiver technology / / URL http /
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674 IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 23, NO. 12, DECEMBER 2013 High-Speed mm-Wave Data-Link Based on Hollow Plastic Cable and CMOS Transceiver