attachment technologies / on-board data processing / technology development requirements / Membrane compatible electronics / semiconductor device technologies / technology development / membrane-compatible electronics / systems technologies / technology development plan / membrane electronics / cost-reducing technologies / thermal management / large-scale manufacturing / technology development roadmap / large aperture systems / systems technology efforts / roll-to-roll manufacturing process / technology development efforts / technology scenarios / energy cycles / important applications / receiver power technology / important technology investment / Passive microwave technology development roadmap / data processing 3S / optical imaging / technology developments / Cost reducing technology development / mesh technology / embedded electronics / industry technology developments / /
MusicGroup
SAR / Demo / Insert / RA / TR / T/R / SAR and L / SSPA / /
Organization
National Oceanic and Atmospheric Administration / NASA ESE / Integrated Mission Design Center / ASIC / Climate / Water / and Weather Services National Weather Service / NASA Cold Land Processes Working Group National Operational Hydrologic Remote Sensing Center office of Climate / National Aeronautics and Space Administration / /
Person
Jim Foster / Francois Rogez / Richard Kelly / John Huang / David Otth / Al Chang / Yunling Lou / Ronald Kruid / Charles Baker / Badri Shirgir / Jan Martin / Terry Doiron / Steven Meyer / Kenneth Hersey / Don Farra / Paul Houser / Don Cline / Greenbelt / / /
Position
Principal Investigator / Chairman / Executive / /
Technology
radiation / semiconductor device technologies / Remote Sensing / 2004 Component Technology / mesh technology / Reducing technology / 2008 System Technology / Microwave / one enabling technology / FINAL REPORT TO NASA EARTH SCIENCE TECHNOLOGY / Enabling technologies / ASIC / MEMS / systems technologies / system technologies / receiver power technology / 2008 Component Technology / 2005 System Technology / 2006 Component Technology / 58 3.7 Technology / 57 3.6 Technology / System Technology / attachment technologies / cost-reducing technologies / microwave technology / /