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Electronic test equipment / Test probe / Probe card / Wafer testing / Nanotechnology / Microscopy / Semiconductor device fabrication / Measuring instruments / Technology


Wafer probe parameters for current carrying capability in semiconductor test Microprobe January Kister, Microprobe March 1, Consumer demand for ever smaller wireless and mobile communications appliances with incr
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Document Date: 2014-05-13 22:47:30

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City

Silesia / San Jose / /

Company

MicroProbe / John Wiley and Sons / Conclusion To / PennWell Corporation / Intel Corporation / /

Country

Poland / United States / /

/

IndustryTerm

OnLine Copyright / system-on-chip / semiconductor devices / production-worthy probe solution / probe tip cleaning protocols / composite metal structure / automotive chips / mobile communications appliances / /

Organization

ISME Probe Council / Haas School of Business / SEMI / /

Person

Jarek (January) Kister / /

/

Position

VP of Engineering and CTO / /

ProgrammingLanguage

Joule / /

ProvinceOrState

Mississippi / Michigan / California / /

Technology

semiconductor / MEMS / system-on-chip / semiconductor devices / probe cards / heat transfer / probe tip cleaning protocols / Wafer Probe Technology / /

URL

http /

SocialTag