San Francisco / Piscataway / Hyderabad / Austin / Tokyo / Philadelphia / Munich / Portland / Oakland / San Jose / Monterey / Orlando / Seattle / Boston / Haifa / Beijing / Graz / Glasgow / San Diego / /
Company
Control data / Joint Test Action Group / N. L. P. / The New York Times / Sony / I/O / Wireless Wireless / Toshiba / Las Vegas NV / /
Continent
Europe / /
Country
Japan / United Kingdom / China / Israel / India / Germany / Austria / / /
Facility
Standard Test Access Port / Computer Science University of California / Engineering University of California / /
IndustryTerm
3D die-stacking technologies / plane applications / 3D integration technology / millimeter-wave wireless technology / brute-force search / signal processing layer / multi-core processors / high energy physics community / composite secure systems / secure alternate services / wireless visible-light link / low-power systems / communication protocol / stacked retinal chip / real-time program profiling / energy efficient / 3D applications / millimeter-wave intra-connect solution / software dependencies / on-chip real estate / Technology impact analysis / can co-processors / dimensionally-decomposed router / retinal chip / slower and more costly custom processors / commodity hardware / mainstream technology / energy efficiency / control applications / manufacturing / computing / trusted computing base / real-time monitoring / bus protocol / secure applications / networkon-chip / trustworthy processors / secure software / modified chip / High energy physicists / hardware solution / indoor optical wireless communications / Near-field wireless power transmission technology / software security / secure services / on-chip interconnection networks / manufacturing technology / software components / disparate technology / fault-tolerant chips / implantable stacked retinal prosthesis chip / malicious software / wireless wafer testing / trustworthy systems / reconfigurable hardware / out-of-order processor / control plane applications / computation hardware / Wireless interconnect offers simpler packaging / cryptographic services / commodity processor / cryptographic processor / particular bus protocol / /
Organization
Cynthia E. Irvine Department of Computer Science Naval Postgraduate School Monterey / University of California / Ryan Kastner Department of Computer Science / National Science Foundation / Naval Postgraduate School / Department of Electrical and Computer Engineering / National Park Service / I. S. Association / /
Person
Cynthia E. Irvine / G. W. Dunlap / Timothy Levin / Ryan Kastner / Ted Huffmire / Timothy Sherwood / S. Cinar / Michael Bilzor / Jonathan Valamehr / Mohit Tiwari / / /
Position
system designer / designer / inspector / conflict resolution manager / controller / King / /
Product
Chip Scale Camera Module / /
ProvinceOrState
Washington / California / Texas / New Jersey / Oregon / Pennsylvania / Florida / Massachusetts / /
PublishedMedium
The New York Times / IEEE Spectrum / IEEE Design & Test of Computers / /
Hardware Trust Implications of 3-D Integration Ted Huffmire, Timothy Levin, Michael Bilzor, and Cynthia E. Irvine Department of Computer Science Naval Postgraduate School Monterey, CA 93943