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Mechanics / Elasticity / Deformation / Solder / Restriction of Hazardous Substances Directive / Reflow soldering / Shear modulus / Printed circuit board / Creep / Electronics manufacturing / Materials science / Physics


An Engelmaier Model for Leadless Ceramic Chip Devices with Pb-free Solder Nathan Blattau and Craig Hillman
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Document Date: 2012-11-27 15:12:14


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File Size: 160,48 KB

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City

College Park / /

Company

Gs Ab / modulus Ab / Boeing / Motorola / Craig Hillman DfR Solutions / /

/

Facility

College Park / /

IndustryTerm

computer electronics / strain energy computation / damage law / energy damage law / strain energy / strain energy density / energy density / cyclic strain energy / energy damage equation / double power law creep model / cyclic strain energy density / energy / /

Organization

Eta / Resistor SnAgCu Solder FR4 Board / /

Person

Max Temp / Werner Engelmaier / Nathan Blattau / /

/

Position

hb / MODEL DEVELOPMENT Solder Shear Stress Computations The structure / /

ProvinceOrState

Maryland / /

PublishedMedium

R&R / /

Technology

30 2512 Chip / 30 20 1206 Chip / 40 30 2512 Chip / /

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