![Electronic engineering / Electrical connectors / Pin header / Electronic design / Printed circuit board / D-subminiature / Wave soldering / Surface-mount technology / Soldering / Electronics manufacturing / Electronics / Electromagnetism Electronic engineering / Electrical connectors / Pin header / Electronic design / Printed circuit board / D-subminiature / Wave soldering / Surface-mount technology / Soldering / Electronics manufacturing / Electronics / Electromagnetism](https://www.pdfsearch.io/img/d3af231d8aaec78680e9d1bab9a9924b.jpg)
| Document Date: 2012-10-29 09:45:15 Open Document File Size: 3,28 MBShare Result on Facebook
Company Molex / / Facility Terminal Plating Tin Tin Tin Tin Series No. / Terminal Type Solder Pin Solder Pin Solder Pin Compliant Pin / / IndustryTerm transportation-vehicle environments / pricing and time saving solutions / through-hole solder processing / wire-bonding technologies / sealedconnection system using matteseal technology / signal applications / search capabilities / body electronics applications / terminal systems / wire-to-board applications / power train applications / transportation industry / compartment applications / wave soldering processing / singe-wire seal technology / temperature automotive and other transportation applications / transportation power-train applications / manufacturing capabilities / keyword search / wire-to-wire connection systems / solder processing / unsealed connector applications / power applications / industrial equipment / power equipment / conductivity applications / trace-routing real estate / body-electronics applications / connector systems / online videos / connection systems / assembly solder processing / on-engine automotive applications / electronics / free solder processing / on-chassis transportation environments / industrial products / compliant-pin technology / search results / module manufacturing process / / NaturalFeature Bay Po / Bay Hybrid / Assembly Bay / Right Angle Bay / Bay Orientation Packaging / Bay 3470*‐4*** / Bay Stackable / Bay Packag / Bays PCB / / Organization Header Blade Retention Force / Vertical Assembly Vertical Housing and Pins Assembly / Mylar Assembly / 75N Unmating Force / Mating Force / Housing / PinsHousing and Pins Assembly / Pins Assembly / Header Pin Retention Force / SEALING Mating Force / Mylar Assembly Assembly Vertical Housing and Pins Assembly / Unmating Force / Housing / Pins and Mylar Assembly / / Person Header Housings / Tray Designed / / / Position Suspension controller / / ProgrammingLanguage C / DC / / PublishedMedium Construction Equipment / / Technology Preliminary Surface Mount Technology / wire-bonding technologies / html / singe-wire seal technology / Configuration High-performing sealedconnection system using matteseal technology / compliant-pin technology / Dielectric / / URL Molex.com / www.molex.com / www.molex.com/link/mx150.html / www.molex.com/mx150.html / www.molex.com/product/cmc.html / www.molex.com/link/stac64.html / www.molex.com/ind/mx123.html / www.molex.com/link/mini50 / /
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