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Semiconductor device fabrication / Materials science / Technology / Electronic engineering / Wafer / Silicon on insulator / Acoustic microscopy / Integrated circuit / Three-dimensional integrated circuit / Soitec / Smart cut


Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA
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Document Date: 2016-07-20 11:09:32


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File Size: 295,66 KB

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