<--- Back to Details
First PageDocument Content
Semiconductor device fabrication / Electronics manufacturing / Integrated circuits / Multi-chip module / Chip scale package / Ball grid array / Printed circuit board / Dual in-line package / Three-dimensional integrated circuit / Electronics / Electronic engineering / Electromagnetism
Date: 2005-07-22 21:03:59
Semiconductor device fabrication
Electronics manufacturing
Integrated circuits
Multi-chip module
Chip scale package
Ball grid array
Printed circuit board
Dual in-line package
Three-dimensional integrated circuit
Electronics
Electronic engineering
Electromagnetism

Add to Reading List

Source URL: nepp.nasa.gov

Download Document from Source Website

File Size: 9,26 MB

Share Document on Facebook

Similar Documents

Electronic engineering / Electronics / Digital electronics / Integrated circuits / Maintenance / Fabless semiconductor companies / Semiconductor devices / Field-programmable gate array / Altera / Ball grid array / Semiconductor intellectual property core / Built-in self-test

Ridgetop Group, IncNorth Oracle Road Tucson, AZPhone: Fax: www.RidgetopGroup.com

DocID: 1rq2g - View Document

Maintenance / Prognostics / Ball grid array / Preventive maintenance / Prognosis / Mission critical / Engineering / Academia / Sustainability

Ridgetop Group was founded in 2000 with the purpose of introducing revolutionary tools for incorporating electronic prognostic into critical systems

DocID: 1rp0o - View Document

Electronic engineering / Electronics / Digital electronics / Maintenance / Integrated circuits / Fabless semiconductor companies / Semiconductor devices / Field-programmable gate array / Prognostics / Altera / Ball grid array / Built-in self-test

FOR IMMEDIATE RELEASE Ridgetop Group, IncNorth Oracle Road Tucson, AZPhone:

DocID: 1r5Xr - View Document

Electronic engineering / Electrical engineering / Electromagnetism / Semiconductor device fabrication / Packaging / Electronics manufacturing / Ball grid array / Surface-mount technology / Solder / Reflow soldering / Integrated circuit packaging / Reliability

CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007

DocID: 1qE27 - View Document

Electronic engineering / Electronics / Electromagnetism / Electronics manufacturing / Soldering / Arduino / Printed circuit board / Solder / Dual in-line package / PCB / Desoldering / Ball grid array

Assembly Guide for the KAPtery SkyShield Kit User manual, parts list, circuit design, and Arduino sketch at KAPtery.com/guides Technical support: http://kaptery.com/contact/ The SkyShield is a custom circuit board which

DocID: 1pRk3 - View Document