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Design / Telecommunications engineering / Very-large-scale integration / Three-dimensional integrated circuit / International Conference on Computer-Aided Design / Design for manufacturability / International Symposium on Physical Design / Multiple patterning / Electric / Electronic engineering / Electronics / Integrated circuits
Date: 2015-01-31 02:10:36
Design
Telecommunications engineering
Very-large-scale integration
Three-dimensional integrated circuit
International Conference on Computer-Aided Design
Design for manufacturability
International Symposium on Physical Design
Multiple patterning
Electric
Electronic engineering
Electronics
Integrated circuits

Graduate Seminar Design for Manufacturability and Reliability in Extreme Scaling and Beyond ECE Seminar Committee

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