| Document Date: 2012-01-10 11:47:02
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Company Lithography Exposure Tool Potential Solutions / Lithography 5 / Lithography International Technology Working Group / / Currency AMD / / Facility Factory Integration / / IndustryTerm mm diameter wafer processing / nm hp flash devices / lithographic technology / nm technology / technology approaches / inverse imaging problem / mask infrastructure / fab infrastructure / optical solutions / chemical engineering / mask-making equipment / lithographic mask patterning systems / sub-wavelength imaging / process technology / volume manufacturing solution / inspection systems / technology extendibility / metrology tools / defect free processing / manufacturing steps / potential solutions / technology requirements / capital equipment / manufacturing / e-beam / contact printing / metal halfpitch / technology option / spacer technology / exposure tool / exposure systems / imaging / manufacturing variations / technology choice / manufacturing process capability requirements / pilot line tools / / MusicAlbum Control / / Organization ASIC / Directed Self Assembly / / Position collector / designer / MP / Model Technology Trend Targets / illuminator / CoO / / Technology ASIC / perhaps two technologies / lithography technologies / spacer technology / 248 nm technology / EUV technology / Lithography Technology / Simulation / alternative patterning technology / process technology / process control / EUV technologies / integrated circuits / 12 Maskless Technology / Flash / generation lithographic technology / CMP / integrated circuit / /
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INTERNATIONAL TECHNOLOGY ROADMAP FOR