CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and Modeling

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Date: 2013-05-28 16:20:41 Heat transfer Passive fire protection Heat conduction Water pollution Heat sink Thermal management of electronic devices and systems Nusselt number Microfluidics Water cooling Mechanical engineering Thermodynamics Chemical engineering		CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and Modeling Add to Reading List Source URL: www.nano-tera.ch Download Document from Source Website File Size: 2,67 MB Share Document on Facebook

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