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Supercomputers / PERCS / POWER7 / Petascale / Multi-core processor / Supernode / Network topology / Fat tree / Node / Computing / Parallel computing / Power Architecture


Document Date: 2012-11-22 12:13:36

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City

San Francisco / Austin / /

Company

IBM Systems / Interconnection Networks / Morgan Kaufmann Publishers Inc. / Lawrence Berkeley National Laboratory / PROD (single and double precision) Software / Technology Group / /

Country

United States / /

Currency

USD / /

/

Event

FDA Phase / /

Facility

University of Illinois / /

IndustryTerm

network management software / silicon technologies / parallel computing / computing protocols / coherence protocol / hub chips / levels metal / optical electronic devices / software stack / interconnect technology / sustained-petascale computing project / Internet Protocol / unreliable protocols / retransmission protocol / computing / non-uniform cluster computing / cache coherence protocol / /

OperatingSystem

L3 / /

Organization

Blue Waters Directorate / Defense Advanced Research Projects Agency / Section IV-D. D. Collectives Acceleration Unit / National Science Foundation / Collective Acceleration Unit / Nest Memory Management Unit / University of Illinois / US Federal Reserve / Project Office / /

Person

Baba Arimilli / Jody Joyner / Jian Li / Scott Clark / Ravi Arimilli / C. Grothoff / V / CALE E XAMPLE / Marc Snir / Jerry Lewis / Jeongnim Kim / Vicente Chung / Ben Drerup / Wolfgang Denzel / Greg Bauer / Bill Kramer / Nan Ni / /

Position

General / author / /

Product

Hub chip / Hub / POWER7 / /

ProvinceOrState

Texas / Illinois / /

Technology

Object-Oriented Programming / thirty-two Hub chips / IP / POWER7 chips / retransmission protocol / using Hub chips / operating system / silicon technologies / cache coherence protocol / 45 nm lithography Cu SOI technologies / Cmp / Hub chip / four POWER7 chips / Section V. The Hub chip / interconnect technology / Hardware-directed randomized route The Hub chip / coherence protocol / hub chips / implemented using 45 nm lithography Cu SOI technologies / /

URL

http /

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