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Microsoft Word - EPTC2012 Call For Papers - extended (letter)
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Document Date: 2012-08-29 14:54:45


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File Size: 1,71 MB

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City

Piscataway / Tokyo / Pittsburgh / New York / San Diego / /

Company

Steve Anderson of STATS ChipPAC / TC-GEMP - Green Electronics Manufacturing / Teck / Electronics Engineers Inc. / EMC / IBM Corporation / IEEE CPMT Society Hong Kong / IEEE CPMT Society Newsletter 1 CPMT Officers / Infineon Technologies AG / AMI Semiconductor / Nokia / R. Wayne Johnson / Packaging Technologies / Fairchild Semiconductor / Power Electronics / Motorola Inc. / Emerging Technologies / Diodes / Electronics Packaging Manufacturing / Cisco Systems Inc. / Aquila / Siliconware Precision Industries / Renavitas Technologies LLC / GE / Volume 2 Number 4 Technologies / Electronics Manufacturing / CPMT Young / Amkor Technology / Advanced Packaging / /

Continent

Africa / Asia / Europe / /

Country

United Kingdom / Japan / Canada / Taiwan / United States / /

Currency

USD / /

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EntertainmentAwardEvent

Jussi / /

Event

Employment Change / /

Facility

Hong Kong University of Science / National Chiao-Tung University / Packaging Foundry / University of California / National University of Singapore / IEEE CPMT Society Hong Kong University of Science / San Diego Zoo / Institute of Electrical / /

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IndustryTerm

portable electronic devices / interconnect technologies / dissimilar chips / energy / millimeter-wave applications / technology corner / micro-electronic systems / Web Account / wire bonding technologies / thermal management solution / potentiostat chip / semiconductor devices / portable communications / dielectric sintering technology / micro-electro-mechanical systems / Web Account username / microelectronics technology / Web Account Needed / interconnect technology / electronics / electronic manufacturing / proposed integration technology / electrical/electronic connector technology / imaging / electronic systems / manufacturing processes / metal oxide semiconductor / manufacturing / film technology / flip chip interconnection technology / charge carrier mobilities / manufacturing technology / microelectromechanical systems / electronic products / block tri-diagonal systems / manufacturing technology centers / nanoceramic technologies / priced manufacturing technology / proposed technology / metal-oxide semiconductor / electrical energy / e-mobility / energy-conversion efficiency decreases / micro-via technology / /

MusicGroup

Ph.D. / /

Organization

University of California / Marsha Tickman IEEE CPMT Executive Office / CPMT Society / CPMT Phoenix Chapter / IEEE Phoenix Section Student Scholarship Endowment / EPTC Board / National University of Singapore / Singapore / Manufacturing Technology Society / Components / Packaging / and Manufacturing Technology Society / CPMT / SEMI / National Chiao-Tung University / Institute of Electrical / Hong Kong University of Science and Technology / IEEE WIE / Package Assembly / IEEE CPMT Society Hong Kong University of Science and Technology Kowloon / Hong Kong / CPMT Society Board / CPMT Society Board of Governors / Joint Reliability/CPMT/ ED Singapore Chapter / CPMT Board of Governors / Institute of Electrical and Electronics Engineers / Santa Clara Valley Chapter / IMAPSEurope / CPMT UK&RI Chapter / IC / /

Person

Paul A. Totta / Azmat Malik / W. Ricky Lee / Nihal Sinnadurai / Walker Receives / Paul Wesling / Katsuyuki Sakuma John / Manfred Kaltenbacher / Michael Glavanovics / Klaus-Dieter Lang / James E. Morris / Heather McCormick / George A. Katopis / Yutaka Tsukada / Jeff Punch / Kaveh Milaninia / Steve Anderson / Xuejun Fan / Rui Li / E. Jan Vardaman / Albert F. Puttlitz / Dan Tracy / Guo-Quan Lu / Mike Ma / Ricky Lee / Peter Read / Rajen Chanchani / Philip Garrou / Elmer Jong-Gwan Yook / Martin Goetz / Richard Popowich / David DiPaola / George G. Harman / Nils F. Nissen / Michael Lebby / John W Elmer Jong-Gwan / Bernd Roemer / Ralph W. Wyndrum / Hao Shih / Lei Wang / Rao Tummala / Prasad Atluri / Bill Chen / Randall Brynsvold / Kyung W. Paik / Karl J. Puttlitz / Jason A. Mix / Maurice N. Collins / Marc Desmulliez Hasan Sharifi David / Andrew A. O. Tay / Raj Pendse / Patricia MacLeod / T. Paul Parker / Luke Theogarajan / William T. Chen / John W. Balde / Sandra Winkler / Mikko Komulainen / Dongkai Shangguan / Ning-Cheng Lee / S. W. Ricky Lee / Dan Kinzer / Gregg Bartlett / Ljubisa Stevanovic / Rao / V / Cheng-Nan Han / Rao R. Tummala / Thomas Aichinger / Debra Fleming / H. Anthony Chan / Lee / V / Kitty Pearsall / Steven Kummerl / Paul D. Franzon / Avram Bar-Cohen / Wong Kitty Pearsall / Eric Jung / Michael Reid / Shen-Li Fu / Jerry Witter / Lionel Cadix / Jie Xue / John Osenbach / Yong-Khim Swee / Herbert Reichl / Mauro J Walker / Robert Lanzone / Qing Huo Liu / Kai Wang / Karl Puttlitz Sr. / Jia Li / Mei Chai / Bruce Kim / Zheng Chen / Mudasir Ahmad / Kishio Yokouchi / Jean Trewhella / Giulio Antonini / Philip E. Garrou / Craig A. Gaw / Tom Tarter / Thomas G. Reynolds III Sr. / Rolf Ashenbrenner / Bahgat Sammakia / Jong-Gwan Yook Xun Luo / Michael Pecht / Cian O Mathuna / John E. Proulx / Package-Induced Stresses Christian Djelassi / Yong-Zhong Xiong / Kevin Gu / Walter Trybula / Luis Eduardo Tobon / R. Wayne Johnson / Jian Yin / Ephraim Suhir / Douglas Hopkins / Johan Liu / John H. Lau / Chin C Lee / Tony Mak / Patrick Thompson / Marsha Tickman / Eric Perfecto / Kwang-Lung Lin / William T. Chen Jr. / William Chen / Rolf Aschenbrenner / Toni Mattila / /

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Position

Executive Director / luncheon keynote speaker / Contractor / Professor / Director of Man u facturing / engineer / scientist / Managing Editor / Program Director / co-founder and Chair / founding chairman / senior vice president and director of manufacturing / Consultant / Editor-in-Chief / Vice President and Director of Man / technical executive / or originator / Executive Chair / Fellow President / Young Engineer / President / chapter advisor / chapter treasurer / Luncheon Program Chair / Engineer / VP / electrical engineer / last President / chapter chair / chair / Senior Industry Analyst / Co-Editor / /

ProgrammingLanguage

FL / /

ProvinceOrState

California / New Jersey / Pennsylvania / New York / /

Region

Latin America / Middle East / /

Technology

flip chip interconnection technology / proposed integration technology / 3-D / microelectromechanical systems / optoelectronics / wire bonding technologies / cell phones / electrical/electronic connector technology / semiconductor / PDF / Electronic Component Technology / proposed technology / dielectric / potentiostat chip / radio frequency / Simulation / 2012 chip / heat transfer / html / microelectronics technology / photolithography / CMOS Chips / MEMS chip / MEMS / 0.5 μm CMOS technology / tantalum film technology / micro-via technology / dielectric sintering technology / priced manufacturing technology / block Thomas algorithm / semiconductor devices / microfluidics / manufacturing technology / integrated circuit / /

URL

www.ieee.org/membership-catalog/productdetail/show / http /

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