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Thermodynamics / Heat transfer / Passive fire protection / Semiconductors / Microfluidics / Thermal management of electronic devices and systems / Heat sink / Computer cooling / Microchannel / Heat conduction / Mechanical engineering / Chemical engineering


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Document Date: 2014-11-18 06:28:46


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ANSYS Inc / IBM / GE / Chrysler / CRC Press / Productivity Press / Ó 2014 Elsevier Ltd. / Straatman AG / Hamann HF. / Analytics Press / /

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Thomas Brunschwiler / Ai / Kim D. Forced / Van Norstrand / Hannah G. Computational / Michel B. Dynamic / Manish K. Tiwari / Bruno Michel / Oliveira Vd / Hernandez-Guerrero A. Numerical / /

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editor / Corresponding author / /

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