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Heat transfer / Heat conduction / Thermodynamics / Heating / ventilating / and air conditioning / Passive fire protection / Heat sink / Thermoelectric cooling / Thermal resistance / R-value / Mechanical engineering / Physics / Chemical engineering


Microsoft Word - TEC_final1-kb.doc
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Document Date: 2009-02-22 20:16:51

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File Size: 477,59 KB

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Company

CRC Press / /

Facility

University of Washington Abstract Microscale Thermoelectric Cooling Elements / /

IndustryTerm

thin metal film / thermal resistance network / test chip / resistance network / numerical solutions / numerical solution / /

Organization

K.F. Böhringer Department of Electrical Engineering / University of Washington Abstract Microscale Thermoelectric Cooling Elements / High Packing Density Assembly for Microchip Solid State Cooling Application / /

Person

Washington Abstract Microscale Thermoelectric Cooling / Tei / /

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Position

TEC model for our analysis / /

ProgrammingLanguage

C / /

Technology

IC chip / heat transfer / State Refrigeration Technologies / integrated circuits / test chip / integrated circuit / /

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