A4.7 (C. Koos N. Lindenmann) [A4.7:1] * N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, Photonic wire bonding: a novel concept for chip-scale interconnects, Opt. - Photonic Chip - Document - PDFSEARCH.IO

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Date: 2015-04-21 02:46:34		A4.7 (C. Koos/ N. Lindenmann) [A4.7:1] * N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, Photonic wire bonding: a novel concept for chip-scale interconnects, Opt. Add to Reading List Source URL: www.cfn.kit.edu Download Document from Source Website File Size: 18,65 KB Share Document on Facebook