<--- Back to Details
First PageDocument Content
Materials science / Three-dimensional integrated circuit / Through-silicon via / Wafer / Chemical-mechanical planarization / Integrated circuit / Microelectromechanical systems / Metrology / Semiconductor device fabrication / Technology / Microtechnology
Date: 2014-06-13 12:55:32
Materials science
Three-dimensional integrated circuit
Through-silicon via
Wafer
Chemical-mechanical planarization
Integrated circuit
Microelectromechanical systems
Metrology
Semiconductor device fabrication
Technology
Microtechnology

Add to Reading List

Source URL: msu.euramet.org

Download Document from Source Website

File Size: 45,43 KB

Share Document on Facebook

Similar Documents

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 12, NO. 6, DECEMBERThermocapillary Actuation of Droplets on Chemically Patterned Surfaces by Programmable

DocID: 1u77o - View Document

Engineering / Electronic engineering / Electronic design / Electromagnetism / Integrated circuits / Microtechnology / Acceleration / Accelerometer / Integrated circuit layout / Microelectromechanical systems / CMOS / Integrated circuit design

Microsoft Word - 03-YCai_MEMSIC_CStudy_jw6_dh1_20081023.doc

DocID: 1r6kx - View Document

Engineering / Technology / Microtechnology / Gyroscopes / Physics / Electrical engineering / Mechanical engineering / Microelectromechanical systems / Transducers / Rate gyro / Accelerometer / Gyro

VG800 LOW DRIFT MEMS VERTICAL GYRO The MEMSIC VG800 establishes a new level of performance for standalone “unaided” inertial

DocID: 1r3e5 - View Document

Chemistry / Microtechnology / Materials science / Engineering / Polymers / LIGA / Semiconductor device fabrication / Microelectromechanical systems / Photoresist / Photolithography / SU-8 photoresist / Poly

Combinatorial Multilevel Mold Insert Using Micromachining and X-ray Lithography V. Singh1, J. Goettert1, O. Jinka1,2,* 1 Center for Advanced Microstructures and Devices (CAMD)

DocID: 1qVW9 - View Document

Technology / Science and technology in Russia / Rusnano / Economy / Structure / Anatoly Chubais / State corporation / Nanotechnology / State-owned enterprise / Microelectromechanical systems

PRESS RELEASERUSNANO Exits from SiTime with Yield Above 25% RUSNANO is exiting its portfolio investment in SiTime Corporation (Sunnyvale, USA), which develops high-performance semiconductor chips using MEMS t

DocID: 1qQgR - View Document