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Semiconductor device fabrication / Electromagnetism / Wafer testing / MOSFET / Ring oscillator / Very-large-scale integration / Wafer / Process corners / Application-specific integrated circuit / Electronic engineering / Integrated circuits / Electronics
Date: 2010-09-27 14:41:05
Semiconductor device fabrication
Electromagnetism
Wafer testing
MOSFET
Ring oscillator
Very-large-scale integration
Wafer
Process corners
Application-specific integrated circuit
Electronic engineering
Integrated circuits
Electronics

Design Dependent Process Monitoring for Back-end Manufacturing Cost Reduction Tuck-Boon Chan∗ , Aashish Pant∗ , Lerong Cheng† , Puneet Gupta∗ {tuckie,apant,puneet}@ee.ucla.edu, [removed], ∗ Depa

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