Back to Results
First PageMeta Content
Chemical-mechanical planarization / Science / Park Systems / Wafer / Profilometer / Atomic force microscopy / 1 micrometre / Semiconductor device fabrication / Technology / Materials science


Chemical Mechanical Polishing (CMP) Metrology with Advanced Surface Profiler >>> Figure 1. The key matrices of metal chemical mechanical
Add to Reading List

Document Date: 2011-11-12 18:00:00

Open Document

File Size: 2,05 MB

Share Result on Facebook

City

Santa Clara / /

Company

Park Systems Japan Inc. / Park Systems Inc. / /

Facility

Park Systems Japan Inc. Nakamaya Bldg. / /

/

IndustryTerm

metal / nm technology node / metal level / destructive contact with real devices / metal chemical mechanical polishing / semiconductor processing / metal line / in-line tool / /

/

ProvinceOrState

California / /

Technology

semiconductor / Chemical Mechanical Polishing / CMP / /

URL

www.parkafm.com / www.parkafm.co.kr / www.parkafm.co.jp / /

SocialTag