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Electronic design / Field-programmable gate array / Application-specific integrated circuit / Fabless semiconductor companies / Gate array / Programmable logic device / CPU design / Microprocessor / Placement / Electronic engineering / Electronics / Integrated circuits


® CORPORATE BACKGROUNDER 3D PROGRAMMABLE LOGIC DEVICES
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Document Date: 2014-03-31 22:23:20


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File Size: 2,26 MB

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Company

FPGAs / SPACETIME / Intel Corporation / ASSPs / Raymond James / Tabula Inc. / Total Worldwide Semiconductor / RTL / 3PLDs / /

Currency

USD / /

Event

Business Partnership / /

Facility

Intel Custom Foundry / /

IndustryTerm

packet processing solutions / video applications / programmable logic device / logic devices / Medical electronics / 3D device / programmable technologies / factory floor automation systems / studio systems / reconfigurable chips / programmable devices / low-volume applications / larger chips / 22nm manufacturing process featuring / logic chips / space equipment / signal processing / clinical and imaging end-equipment segments / manufacturing customers / electronic products / much larger chips / programmable solutions / safety systems / manufacturing access agreement / performance systems / safer and more reliable manufacturing systems / specialpurpose chips / 4G wireless technology / programmable logic devices / video-enabled portable electronics / mobile data applications / process technology / packet processing / closure technologies / generation products / automotive infotainment applications / communications applications / diverse / consumer applications / avionics systems / typical logic chip / energy efficiency / wireless industry / packet processing applications / industry‐leading technologies / higher bandwidth requirements such applications / 22nm manufacturing process / manufacturing capability / energy vehicles / 3PLD devices / search engine / 3PLD device / co-optimized packaging technology / in-vehicle networking / personal transportation / /

Organization

MIT / PLD ASIC / ASSP / ASIC / Industrial Military / /

Person

Clive Maxfield / Sunit Rikhi / Teig / Hans Mosesmann / /

Position

CONFIG/WRITER / designer / Managing Director / vice president / Technology and Manufacturing Group / ANALYST / vice president / Technology and Manufacturing Group / /

Product

3PLD / ABAX2P1 3PLD device / 22nm ABAX2 3PLDs / 22nm / ABAX2P1 / ABAX2P1 3PLD / /

ProgrammingLanguage

TCL / /

ProvinceOrState

Manitoba / /

Technology

semiconductor / FPGA / resulting chips / RAM / 3-D / timing closure technologies / ASSP chips / specialpurpose chips / Search Engine / Quality of Service / process technology / VHDL / Integrated Circuits / same chip / MRI / co-optimized packaging technology / much larger chips / cellular telephone / ASIC / VERILOG / Flow Control / Aero / typical logic chip / logic chips / rapidly reconfigurable chips / 22nm TRI-GATE PROCESS TECHNOLOGY / DSP / 4G wireless technology / integrated circuit / /

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