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Document Date: 2007-11-12 09:49:26Open Document File Size: 724,23 KBShare Result on FacebookCompanyElectronics Engineers Inc. / Random logic / Intel Corporation / /IndustryTermnm technologies / system-on-chip / low-volume commercial products / phrase metal oxide semiconductor / manufacturing perspective / nm technology / device manufacturing / low manufacturing costs / radar systems / Well-developed software / silicon devices / semiconductor devices / Metal resistance / personal computing / satellite communications / Minimum metal width / large-volume products / metal width / metal layers / software development / energy / similar chips / transistor devices / metal / radiation-hardening applications / metal level / ductor chip / information-processing chip / metal gate electrode / chip design/manufacturing environment / process technology / metal oxide semiconductor / aerospace industries / technology node / equivalent silicon device / close metal / metal pitch / process technology advances / mainstream process technology / /MovieThe Big Picture / /OrganizationASIC / /PersonGordon E. Moore / Jack Kilby / /Positioncofounder / /Technologysemiconductor / Design verification / FPGA / radiation / ADC / CHIP DESIGN / CMOS technologies / 90 nm technology / 3 ductor chip / semiconductor devices / SOI technology / microwave / mobile phones / process technology / integrated circuits / one chip / CMOS technology / ASIC / 32 nm technologies / system-on-chip / network routers / information-processing chip / PROCESS TECHNOLOGIES / 65 nm technology / mainstream process technology / SOI chips / satellite communications / integrated circuit / SoC chips / /SocialTag |