| Document Date: 2011-03-28 09:08:57 Open Document File Size: 1.019,20 KBShare Result on Facebook
Company IBM / TE / The Working Group / SLM / / Country Japan / Italy / United Kingdom / / Event Product Recall / FDA Phase / Product Issues / / Facility PS East Hall / / IndustryTerm metal / read-out chips / gas cooling / µm thin chips / size device / ancillary devices / low temperature nitrogen gas / front-end electronics / sub-systems / final electronics / read-out chip / electronics / off-detector electronics / high energy / fit procedure accounting / test infrastructure / final read-out chip / vacuum / read-out electronics / carrier board / high energy searches / / Organization ASIC / / Product architecture of an off-detector card / T10 / DE4 / / ProgrammingLanguage CEDAR / / Technology Ethernet / FPGA / radiation / laser / ASIC / read-out chip / 100 µm thin chips / final read-out chip / read-out chips / SDRAM / simulation / prototype read-out chips / CAD / /
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