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Semiconductor device fabrication / Quad-flat no-leads package / Electronics manufacturing / Quad Flat Package / Integrated circuit packaging / Dual in-line package / Small-outline integrated circuit / Printed circuit board / Ball grid array / Electronics / Electronic engineering / Microtechnology


Advanced Lead Frame Services— From Design to Delivery ® QPL
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Document Date: 2014-01-22 22:33:49

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File Size: 3,29 MB

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City

Shanghai / /

Company

QPL Limited / Texas Instruments / Furukawa / /

Country

United States / China / /

Facility

Headquarters QPL / Xin An Industrial Park / With headquarters / AXA Life Building / /

/

IndustryTerm

sheet metal / metal / real estate / automatic downset/taping equipment / portable devices / conveyor-type cleaning process / array package solution / manufacturing lead frames / preferred lead frame supplier / chip scale applications / laser plotter systems / frame manufacturing / sheet metal strip / encapsulation technologies / laser-based inspection systems / memory devices / /

Organization

US Federal Reserve / IDF / /

Person

Li Tung Lok / Hale Weal / /

/

Region

Asia Pacific / /

Technology

semiconductor / laser / IC chip / lasers / larger IC chip / Random Access / flash / Integrated Circuit / Plastic Leaded Chip / /

URL

www.qpl.com / /

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