Back to Results
First PageMeta Content
Electromagnetism / Quad-flat no-leads package / Surface-mount technology / Quad Flat Package / Printed circuit board / Small-outline integrated circuit / Rework / PCB / Reflow soldering / Electronic engineering / Electronics manufacturing / Electronics


Document Date: 2013-01-24 17:30:53


Open Document

File Size: 1,90 MB

Share Result on Facebook

City

JEDEC / /

Company

Freescale Semiconductor Inc. / /

IndustryTerm

manufacturing yield / secondary supplier / user specific solution / /

Organization

MAP QFN / PCB Assembly / performed using a 0.5mm pitch MAP QFN / /

Technology

Flash / /

SocialTag